New LGA 1700 CPU Air Cooler
€ 24.00
Description
• Free Delivery
• Innovative Y-shaped Fins:
The extra fine cooling fins are designed in a Y-shape, which enhances the heat dissipation efficiency. This unique fin design helps in spreading the heat more effectively and optimizes airflow around the heat sink.
• High Thermal Conductivity:
The cooling system retains the high thermal conductivity of aluminum, which is critical for efficient heat transfer. The use of aluminum ensures that heat is quickly conducted away from the components, preventing overheating.
• Advanced Extrusion Process:
The novel extrusion process employed in the production of the cooling fins ensures that the full potential of the aluminum’s thermal properties is realized. This method contributes to the overall high-performance characteristics of the cooler.
• Compact Yet High-Performance:
Despite its compact size, the radial heat sink is designed for high performance. The increased surface area of the heat sink allows for better heat dissipation, and the optimized airflow leads to improved overall cooling efficiency.
• Cooling Efficiency:
The overall result is a significant increase in cooling performance, effectively managing heat to maintain optimal temperatures for the components, even in compact spaces.
• Innovative Y-shaped Fins:
The extra fine cooling fins are designed in a Y-shape, which enhances the heat dissipation efficiency. This unique fin design helps in spreading the heat more effectively and optimizes airflow around the heat sink.
• High Thermal Conductivity:
The cooling system retains the high thermal conductivity of aluminum, which is critical for efficient heat transfer. The use of aluminum ensures that heat is quickly conducted away from the components, preventing overheating.
• Advanced Extrusion Process:
The novel extrusion process employed in the production of the cooling fins ensures that the full potential of the aluminum’s thermal properties is realized. This method contributes to the overall high-performance characteristics of the cooler.
• Compact Yet High-Performance:
Despite its compact size, the radial heat sink is designed for high performance. The increased surface area of the heat sink allows for better heat dissipation, and the optimized airflow leads to improved overall cooling efficiency.
• Cooling Efficiency:
The overall result is a significant increase in cooling performance, effectively managing heat to maintain optimal temperatures for the components, even in compact spaces.
Item Details
9843439
29
Consumer Electronics
07/11/2024
New